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CLASS 10K
| A1-CVD |
| C-V Measurement |
| Cu-CVD |
| Deep-UV Mask Aligner (KARL SUSS) |
| Differential Hall Measurement |
| DLTS |
| Ellipsometer |
| HF Measurements |
| Hot Electron Analyzer |
| HP 4145 |
| K1 236 |
| Laser Scan Microscope |
| Liquid Source CVD |
| Metal-CVD |
| PECVD |
| Photo-resist Asher |
| RIE for III-V Compounds |
| Single E-gun Evaporater |
| Ti/TiN/A1/Si-Cu/Co-PVD |
Class 10
| E-Beam (JOE) |
| P. R. Processing for Mask |
| Clean Bench |
| CMP |
| CMP Post-cleaning |
| E-Beam Lithography System(Leica) |
| Four Point Probe |
| FTIR |
| Furnace and LPCVD |
| Fusion Ozone Asher |
| G-Line Stepper |
| I-line Stepper |
| M-Gauge |
| Mask C.D. Measurement |
| Medium Current Implanter |
| Metal Etcher |
| Metal RTA-AG610 |
| Nano Spec |
| Oxide Etcher |
| Poly-Silicon Etcher |
| PR Coater & Develop & Oven |
| RTA-AG |
| Silicon Nitride RIE |
| Sputtering |
| Surface Profiler |
| Surface Scan |
| Thin-Film Stress Measurement |
| UHV-CVD |
| W-CVD |
Analyses and Characterization
| SPM |
| AFM (8"wafer) |
| FESEM |
| SAM / ESCA |
| SIMS |
| Surface Profiler |