組別：主任室

姓名：戴寶通

職稱：研究員兼技術長

學歷：

• 美國南加州大學電機工程博士

經歷：

• 國家奈米元件實驗室研究員(1992年10月~迄今)員
• 台灣茂矽電子公司副總經理(1990 ~1992年)
• 工研院電子工業研究所正工程師兼組長(1974~1990)

研究與技術專長：

• 積體電路製造技術
• 積體電路連線技術的發展與研究
• 奈米太陽能電池製造
• 微奈米結構製造
• 奈米科技製造技術的發展與研究

個人著作：(點擊以展開)

• 期刊論文
1. S.H. Shiau, C.W. Liu, C. Gau and B.T. Dai, “Characterization of an as-grown n-type SWNTs film,” appear in Nanotechnology. (SCI, IF: 3.037)
2. S.H. Shiau, C.W. Liu, C. Gau and B.T. Dai, “Growth of a single-wall carbon nanotube film and its patterning as an n-type field effect transistor device using an integrated circuit compatible process,” Nanotechnology, Vol. 19, No. 10, 105303, 2008. (SCI, IF: 3.037)
3. J.Y. Fang, M.S. Tsai, B.T. Dai, Y.S. Wu and M.S. Feng, “Effect of Surface Passivation Removal on Planariz Efficiency in Cu Abrasive-Free Polishing”, J. Electrochem. Soc., Volume 153, Issue 1, pp. G44-G46 (2006).
4. J.Y. Fang, P.W. Huang, M.S. Tsai, B.T. Dai, Y.S. Wu and M.S. Feng, “Study on pressure-independent Cu removal in Cu abrasive-free polishing”, Electrochem. and Solid State Letters, 9 (1): G13-G16 2006.
5. Y.S. Ho, M.H. Weng, B.T. Dai and S.S. Wang, “Nono Particles and Microwave Dielectric Properties of sol-gel Derived Zr0.8Sn0.2TiO4 Ceramics”, Jpn. J. Appl. Phys, Vol 8A, August, pp. 6152-6155, 2005.
6. A.T. Cho, J.M. Shieh, J. Shieh, Y.F. Lai, B.T. Dai, F.M. Pan, H.C. Ku, Y.C. Lin, K.J. Chao and P.H. Liu, “Emission of Bright Blue Light from Mesoporous Silica with dense Si (Ge) Nanocrystals”, Electrochemical and Solid-State Letters, 8(6), G143 (2005).
7. S.H. Liu, J.M. Shieh, C. Chen, B.T. Dai, Karl Hensen and S.S. Cheng, “Two-Additive Electrolytes for Superplanarizing Damascene Cu Metals”, Electrochem. and Solid-State Letters, 8(3), C47 (2005).
8. J.Y. Fang, M.S. Tsai, B.T. Dai, Y.S. Wu and M.S. Feng, “Pattern Effect Optimized with Non-Native Surface Passivation in Copper Abrasive-Free Polishing”, Electrochem. and Solid-State Lett., Volume 8, Issue 5, pp. G128-G130 (2005).
9. S.C. Chang, J.M. Shieh J.Y Fang, B.T. Dai, M.S. Feng and Y.L. Wang, “The Roles of Copper Mechanical Characteristics in Electropolishing”, Journal of Vacuum Science & Technology B, 22(1), 116 (2004).
10. J.H. Wu, J.M. Shieh, B.T. Dai, and Y.C. Wu, “Synthesis of Microcrystalline Silicon at Room-temperature Using Inductively Coupled Plasma,” Electrochem. and Solid-State Letters, 7(6), G128 (2004).
11. S.C. Chang, J.M. Shieh, J.Y. Fang, B.T. Dai, M.S. Feng, and Y.L. Wang, “The Role of Copper Mechanical Charateristics in Electropolishing,” J. Vac. Sci. Techno., B 22(1), 116 (2004).
12. S.C. Chang, J.M. Shieh, B.T. Dai, and M.S. Feng, “Improving the Quality of Electroplated Copper Films by Rapid Thermal Annealing,” J. Vac. Sci. Technol., B 21(2), 858 (2003).
13. S.C. Chang, J.M. Shieh, B.T. Dai, M.S. Feng, Y.H. Li, and M. H. Tsai, “Super-Polishing for Planarizing Copper Damascene Interconnects,” Electrochem. and Solid-State Letters 6(5), G72 (2003).
14. C.W. Liu, C.L. Cheng, J.T. Jeng, B.T. Dai and S.W. Huang, “Characterization of various alloying metal oxide nanoparticles embedded in HfOxNy as charge trapping nodes in nonvolatile memory devices,” Microelectronic Engineering, Vol. 85, pp. 1766-1771, 2008. (SCI, IF: 1.398)
15. C.W. Liu, C.L. Cheng, S.W. Huang, J.T. Jeng, S.H. Shiau and B.T. Dai, “Bimetallic oxide nanoparticles CoxMoyO as charge trapping layer for nonvolatile memory devices applications,” Applied Physics Letters, Vol. 91, 042107, 2007. (SCI, IF: 3.977) This paper has been selected for the August 6, 2007 issue of Virtual Journal of Nanoscale Science & Technology.
16. C.W. Liu, C.Y. Kuo, C.P. Wang, S.H. Shiau, C. Gau and B.T. Dai, “Low temperature synthesis of single crystalline silicon nanowires using anodic aluminum oxide template,” Jpn. J. Appl. Phys., Vol. 46, No. 9B, pp. 6343-6345, 2007. (SCI, IF: 1.222)
17. H.S. Wen, L.F. Tsai, C.W. Liu, S.L. Shy, B.T. Dai, P.C. Liao, Y.C. Tyan and C.Y. Wang, “Effects of carbon nanospheres as matrix on MALDI-TOF analysis,” Jpn. J. Appl. Phys., Vol. 46, No. 9B, pp. 6415-6418, 2007. (SCI, IF: 1.222)
18. C.W. Liu, C. Gau, H.S. Ko and B.T. Dai, “Fabrication challenges for a complicated micro-flow channel system at low temperature process,” Sensors and Actuators A: Physical, Vol. 130-131, pp.575-582, 2006. (SCI, IF: 1.434)
19. M.H. Weng, T.H. Huang, J.G. Chang, C.Y. Hung and B.T. Dai, “Miniaturized Multilayer Hairpin Bandpass Filter with Tunable Transmission Zeros,” Microwave & Opt. Tech. Lett, Vol 41, NO1, pp 53-55, April 2004.
20. C.W. Liu, C. Gau and B.T. Dai, “Design and fabrication development of a micro flow heated channel with measurements and analysis of the inside micro-scale flow and heat transfer process,” Biosensors and Bioelectronics, Vol. 20, pp.91-101, 2004. (SCI, IF: 4.132)
21. J.M. Shieh, A.T. Cho, Y.F. Lai, B.T. Dai, F.M. Pan, and K.J. Chao, “Stable Blue Luminescence from Mesoporous Silica Films,” Electrochem. and Solid-State Letters, (2004)
22. J.M. Shieh, Z.H. Chen, B.T. Dai, Y.C. Wang, A. Zaitsev, and C.L. Pan, “Infrared Femtosecond Laser-induced Crystallization of Amorphous Silicon,” Appl. Phys. Lett., 85(7), 1232 (2004).
23. J.M. Shieh, S.C. Chang, Y.L. Wang, B.T. Dai, and J.Ting, “Reduction of Etch Pits of Electropolishing Copper by Additives,” J. Electrochem. Soc., 151(7), C459 (2004).
24. F.K. Liu, Y.C. Chang, F.H. Ko, T.C. Chu, B.T. Dai, “Rapid Fabrication of High Quality Self-assembled Nanometer Gold Particles by Spin Coating Method,” Microelectronic Engineering, 67-68, 702-709 (2003).
25. F.K. Liu, S.Y. Hsieh, F.H. Ko, T.C. Chu, and B.T. Dai, “Synthesis of Nanometer-Sized Poly (methyl methacrylate) Polymer Network by Gold Nanoparticle Template, ” Jpn. J. of Appl. Phys., pt.1, 42, 4147 (2003).
26. F.K. Liu, C.J. Ker, Y.C. Chang, F.H. Ko, T.C. Chu, and B.T. Dai, “Microwave Heating for the Preparation of Nanometer Gold Particles,” Jpn. J. of Appl. Phys., pt.1, 42, 4152 (2003).
27. J.M. Shieh, K.C. Tsai, and B.T. Dai, “Ultralow Copper Drift in Inductively Coupled Plasma Silicon Carbide Dielectrics,” Appl. Phys. Lett. 82(12), 1914 (2003).
28. K.C. Tsai, J.M. Shieh, and B.T. Dai, “Inductively Coupled Plasma Deposited Silicon Oxycarbide interlayers,” Electrochem. and Solid-State Letters 6(10), F31 (2003).
• 會議論文
1. C.W. Liu, Y.H. Lee, and B.T. Dai, “Synthesis of black microcauliflower hybrid silicon quantum dots by vapor-liquid-solid technique,” Proceedings of the 4th Asian Conference on Crystal Growth and Crystal Technology (CGCT4), Sendai, Japan, May 21-24, 2008.
2. C.L. Cheng, C.W. Liu, Y.H. Lee, J.T. Jeng, and B.T. Dai, “Anti-reflective characterization of black hybrid silicon nano-materials (HSNMs) by vapor-liquid-solid technique,” Proceedings of the 4th Asian Conference on Crystal Growth and Crystal Technology (CGCT4), Sendai, Japan, May 21-24, 2008.
3. H.L. Tsai, C.W. Liu, T.H. Tsou and B.T. Dai, “Synthesis of tapered silicon nanowires for field emission application,” Proceedings of the 4th Asian Conference on Crystal Growth and Crystal Technology (CGCT4), Sendai, Japan, May 21-24, 2008.
4. C.W. Liu, C.Y. Kuo, C.P. Wang, C. Gau, S.H. Shiau and B.T. Dai, “Synthesis of well aligned silicon nanowire arrays by reflow of photoresist techniques,” Proceedings of the 7th IEEE International Conference on Nanotechnology (IEEE-NANO 2007), Hong Kong, China, August 2-5, 2007.
5. S.H. Shiau, C.W. Liu, C. Gau, C.L. Cheng, S.W. Huang and B.T. Dai, “Selective growth of high purity single-walled carbon nanotubes network from alcohol,” Proceedings of the 7th IEEE International Conference on Nanotechnology (IEEE-NANO 2007), Hong Kong, China, August 2-5, 2007.
6. C.W. Liu, C.Y. Kuo, C.P. Wang, C. Gau, S.H. Shiau and B.T. Dai, “Synthesis of silicon nanowires array using anodic aluminum oxide template at low temperature process,” Proceedings of the International Electron Devices and Materials Symposia 2006 (IEDMS’2006), Tainan, Taiwan, December 7-8, 2006.
7. C.W. Liu, C.Y. Kuo, C.P. Wang, C. Gau and B.T. Dai, “Low temperature synthesis of single crystal silicon nanowires using anodic aluminum oxide template,” Proceedings of the 19th International Microprocesses and Nanotechnology Conference technology (MNC 2006), Kanagawa, Japan, October 25-27, 2006.
8. C.W. Liu, C. Gau and B.T. Dai, “Fabrication challenge for a complicated micro-flow channel system at low temperature process,” Proceedings of the 13th International Conference on Solid-State Sensors and Actuators (Transducers’05), Seoul, Korea, June 5-9, 2005.
9. C.W. Liu, H S. Ko, C. Gau and B.T. Dai, “Channel Fabrication Integrated with Arrays of Micro Pressure Sensors,” Proceedings of the 12th Symposium on Nano Device Technology, Hsinchu, Taiwan, May 4-5, 2005.
10. S.L. Shy, L.F. Tsai, H.S. Wen, B.T. Dai, Y.C. Ting, Peter Hsu and M.C. Lee , “65 nm Mask Tooling Using Mix-and-match Method”, SNDT2005.
11. M. H. Weng, Y. D. Lin, H. D. Hsueh, Y. S. Cheng and B.T. Dai, “Design and Fabrication of A MEMS Capacitive Switch”, Symposium on Nano Device Technology 2005, Hsinchu.
12. Z. H. Chen, J. M. Shieh, B. T. Dai, Y. C. Wang and C. L. Pan, “ Near-infrared Femtosecond Laser-Processed Thin-Film Transistor”, oral presentation, CFG7, Conference on Laser and Electro Optics 2005 (CLEO ‘05).
13. J. M. Shieh, A. T. Cho, Y. F. Lai, B. T. Dai, H. C. Kuo and Y. C. Lin, “Efficient Blue-luminescent Nanomaterial of Semiconducting Nanocrystal/Silica Arrays”, oral presentation, CMII3, Conference on Laser and Electro Optics 2005 (CLEO ‘05).
14. C.W. Liu, C. Gau, C.S. Yang and B.T. Dai, “Fabrication and design of heat transfer microchannel system at low temperature process by MEMS technique”, Proceedings of the 3rd IEEE International Conference on Sensors, Vienna, Austria, October 24-27, 2004.
15. M. Wang, B.T. Dai, MS. Tsai and G. C. Tu, “Electrochemical Characterization on Packing Density of Alkylchlorosilane Monolayer”, 205th Meeting of The Electrochemical Society, May 9-May 14, 2004.
16. B. W. Huang, J.Y. Fang, KC. Hsuen, M.S. Tsai, BT. Dai, M.S. Feng, C.F. Yeh and H.C. Shi, ”Study of BTA Derivatives in Cu Abrasive Free Polishing”, 205th Meeting of The Electrochemical Society, May 9-May 14, 2004.
17. Z.H. Chen, J M. Shieh, Y.F. Lai, B.T. Dai, Y.C. Wang and C. L. Pan, “A Novel Femto-second Laser Annealing for TFT Device”, 2004 Material Research Society Spring Meeting, April 12-16, 2004, CA, USA (MRS 2004).
18. S.H. Liu, C. Chen, J.M. Shieh and B.T. Dai,“Electropolishing of Copper with High Planarization Efficiency and Low Surface Defect”, Oral K3.5, Material Research Society Spring Meeting, April 12 - 16, 2004, Moscone West, San Francisco, CA, USA (MRS 2004).
19. Y.C. Ting, S.L. Shy, M.C. Lee and B.T. Dai, “ Nanofabrication of Nano Pattern and Micro-Devices using Contact/ Proximity Lithography”, SPIE Proceeding 5446 Photomask and NGL Mask Technology XI
20. S.L. Shy, LF. Tsai, B.T. Dai, Y.C. Ting, M.C. Lee and Peter Peming Hsu, “Application of Glass and PDMS Micro-reactors for Chemical Reaction”, 3rd Cross- Strait Work Shop on Nano Science & Technology 4/27-29, 2004 Hualien Taiwan
21. K.C. Tsai, J.M. Shieh, Z.H. Chen, and B.T. Dai, “Ultralow Copper Drift in Inductively Coupled Plasma Silicon Carbide Dielectrics,” AVS Fourth International Conference on Microelectronics and Interfaces (ICMI, 2003)
22. M.H. Weng, T.J. Liang, J.G. Chang and B.T. Dai, “Fabrication of Monoblock Ceramics Bandpass Filters with Upper Attenuation Poles,” Symposium on Nano Device Technology 2003, Hsinchu
23. W.N. Chen, M.H. Weng, T.H. Huang, T.C. Cheng and B.T. Dai, “Microstrip Parallel Coupling Bandpass Filter using Overlap-Gap Coupling Structures,” Symposium on Nano Device Technology 2003, Hsinchu.
24. W.N. Chen, M.H. Weng, H.W. Wu, T.C. Cheng and B.T. Dai, “A High Performance Wide-band Microstrip Bandstop Filter,” Symposium on Nano Device Technology 2003, Hsinchu..
25. W.N. Chen, M.H. Weng, C.Y. Hung, T.C. Cheng and B.T. Dai, “Novel Low Spurious Bandstop Filter using Microstrip Patch Structure,” Symposium on Nano Device Technology 2003, Hsinchu.
• 專書論文
• 專利